- Kuech, T.F. and Ning Liu and Tong-Ho Kim and Changhyun Yi and Brown, A.S., Alternative substrates for InP and related materials,
2003 International Conference Indium Phosphide and Related Materials. Conference Proceedings (Cat. No.03CH37413)
pp. 562 - [ICIPRM.2003.1205442] .
(last updated on 2007/04/14)
We will present examples of wafer bonding as applied to InGaAs/InP system highlighting the effects of the bonding process on the post-bonding device characteristics. Some future directions of alternative substrates for use in InP technologies will be presented
gallium arsenide;III-V semiconductors;indium compounds;substrates;wafer bonding;