Papers Published
- Calhoun, K.H. and Camperi-Ginestet, C.B. and Jokerst, N.M., Vertical optical communication through stacked silicon wafers using hybrid monolithic thin film InGaAsP emitters and detectors,
IEEE Photonics Technology Letters, vol. 5 no. 2
(1993),
pp. 254 - 257 [68.196022] .
(last updated on 2007/04/16)Abstract:
Optical communication through stacked silicon wafers has been demonstrated for the first time using hybrid monolithic thin film InP/InGaAsP light emitting diodes and double heterostructure p over-bar -i-n photodetectors operating at λ = 1.3 μm. A modified epitaxial liftoff technique was employed to align and deposit an emitter on a nitride coated, polished silicon wafer and to similarly deposit a detector on an identical silicon wafer. These wafers were then stacked with the emitter and detector aligned to demonstrate optical communication through stacked silicon wafers. This inexpensive and manufacturable three-dimensional optical interconnection scheme is a promising technology for implementation of massively parallel signal processing systems.Keywords:
Integrated optics;Monolithic integrated circuits;Photodetectors;Light emitting diodes;Parallel processing systems;