Papers Published

1. Seo, S.W. and Geddis, D.L. and Jokerst, N.M., 3-D stacked thin-film photodetectors for multispectral detection applications, IEEE Photonics Technology Letters, vol. 15 no. 4 (2003), pp. 578 - 580 [LPT.2003.809273] .
   (last updated on 2007/04/16)

   Abstract:
   To demonstrate simultaneous multispectral detection, short and long wavelength thin-film detectors, which are grown and optimized separately, are collocated and heterogeneously integrated in a three-dimensional (3-D) stack onto pads on an Si substrate. Simultaneous two-color detection by each detector in the 3-D stack has been measured and theoretically explored. This heterogeneous integration of two different detectors in a 3-D stack is an interesting physical integration technology for multispectral imaging systems and coarse wavelength-division-multiplexing systems.

   Keywords:
   Thin film devices;Spectrum analysis;Semiconductor growth;Optimization;Three dimensional;Substrates;Semiconducting silicon;Imaging systems;Wavelength division multiplexing;Integrated optoelectronics;Semiconducting gallium arsenide;Optical beam splitters;