Papers Published

1. Buchanan, B. and Camperi-Ginestet, C. and Morris, T. and Brooke, M. and DeWeerth, S. and Jokerst, N. and Allen, M., High density focal plane signal processing using 3-D vertical interconnects, Midwest Symposium on Circuits and Systems, vol. 1 (1994), pp. 191 - 194 [MWSCAS.1994.519220] .
   (last updated on 2007/04/16)

   Abstract:
   A four by four array of GaAs P-i-N photodetectors was integrated onto a metalized silicon substrate and directly on top of an array of silicon circuits. The resultant focal plane processor at each location in the array converts the incident light intensity to alogrithmically encoded frequency signal.

   Keywords:
   Optical interconnects;Three dimensional;Arrays;Semiconducting gallium arsenide;Photodetectors;Signal encoding;Substrates;Semiconducting silicon;Integrated circuit layout;