Papers Published

1. Camperi-Ginestet, C. and Buchanan, B. and Jokerst, N.M. and Brooke, M.A., Bidirectional communication through stacked silicon circuitry by using integrated thin-film InP-based emitters and detectors, CLEO '95. Summaries of Papers Presented at the Conference on Lasers and Electro-Optics (IEEE Cat. No. 95CH35800) (1995), pp. 397 - 8 .
   (last updated on 2007/04/16)

   Abstract:
   Summary form only given. The processing density of silicon circuitry is currently limited by the two-dimensional nature of the interconnections on silicon circuits. In addition, parallel processing is an attractive architecture for many applications, such as image processing and generation. To extend the interconnectivity of silicon into the third dimension and to achieve a high degree of parallel processing, we demonstrate herein the vertical optical interconnection of two low cost silicon circuits. This bidirectional vertical optical communication through stacked silicon circuits is achieved by integrating thin-film InGaAsP based emitters and photodetectors that operate at 1.3 μm (to which the silicon is transparent) directly onto the silicon circuit

   Keywords:
   gallium arsenide;gallium compounds;III-V semiconductors;image processing;indium compounds;integrated optoelectronics;light emitting diodes;optical films;optical interconnections;parallel architectures;photodetectors;