Publications [#66482] of Nan M. Jokerst

Papers Published

1. Bond, S.W. and Jung, S. and Vendier, O. and Brooke, M.A. and Jokerst, N.M., 3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections, 1998 IEEE/LEOS Summer Topical Meeting. Digest. Broadband Optical Networks and Technologies: An Emerging Reality. Optical MEMS. Smart Pixels. Organic Optics and Optoelectronics (Cat. No.98TH8369) (1998), pp. 27 - 8, Monterey, CA, USA [LEOSST.1998.690406]
   (last updated on 2007/04/16)

   Abstract:
   We have presented the first demonstration of an optically interconnected three dimensional smart pixel system connecting three stacked layers of Si CMOS VLSI circuitry. We have demonstrated vertical optical communication between three CMOS circuit layers with operation speeds up to 1 Mbps. This system demonstrates the viability of implementing optical interconnections for scalable 3D interconnection systems for ultra-smart pixel applications

   Keywords:
   CMOS integrated circuits;digital signal processing chips;integrated optoelectronics;optical interconnections;silicon;smart pixels;VLSI;