Publications [#283662] of Qing H. Liu

Papers Published

1. Kong, FZ; Yin, WY; Mao, JF; Liu, QH, Transient electro-thermo-mechanical responses of wire bonding interconnects illuminated by an electromagnetic pulse, Proceedings of 2008 Asia Pacific Microwave Conference, Apmc 2008 (December, 2008), IEEE [doi]
   (last updated on 2023/08/08)

   Abstract:
   Time-dependent electro-thermo-mechanical transient characterizations of wire bonding interconnects illuminated by an electromagnetic pulse are investigated in this paper. in the mathematical implementation, a hybrid time-domain finite element method is applied to simulate mutual interactions among electrical, thermal, and mechanical fields, with all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Young's modulus of materials being treated appropriately. Therefore, three-dimensional (3-D) temperature and thermal stress distributions of single, serial and parallel wire bonding interconnects used for connecting high power RF transistors are captured numerically and discussed. ©2008 IEEE.