Papers Published

1. Bejan, A. and Lee, S.W., Optimal geometry of convection cooled electronic packages, Cooling of Electronic Systems. Proceedings of the NATO Advanced Study Institute (1994), pp. 277 - 91 .
   (last updated on 2007/04/06)

   Abstract:
   This is a review of a new class of fundamental results concerning the optimal spacing of parallel heat generating boards arranged in a stack of fixed volume. The cooling is by single-phase laminar flow, in natural convection or forced convection. Several board models are considered: smooth boards with uniform temperature or uniform heat flux, flush mounted heat sources, protruding heat sources, and a board cooled in its own (insulated) parallel plate channel

   Keywords:
   convection;cooling;laminar flow;packaging;printed circuit design;