Papers Published

  1. Brevnov, D. A. and Gamble, T. C. and Atanassov, P. and Lopez, G. P. and Bauer, T. M. and Chaudhury, Z. A. and Schwappach, C. D. and Mosley, L. E., Electrochemical micromachining - Porous-type anodization of patterned aluminum-copper films, ELECTROCHEMICAL AND SOLID STATE LETTERS, vol. 9 no. 8 (2006), pp. B35--B38 [doi] .
    (last updated on 2010/02/08)

    Porous-type anodization of patterned similar to 10 mu m thick Al-Cu films results in microstructures with alternating regions of Al-Cu and porous Al2O3. The volumetric expansion of porous Al2O3 is minimized by increasing the anodization solution temperature. The fidelity of the mask transfer (10 mu m wide) is compromised by the lateral pore propagation under the anodization mask. The Al-Cu pillars formed after complete dissolution of porous Al2O3 have a trapezoidal shape. The height of pillars is twice (8 mu m) the distance corresponding to the lateral pore propagation (4 mu m). In contrast to wet chemical etching, porous- type anodization of patterned Al-Cu films is not isotropic. (c) 2006 The Electrochemical Society.