Math @ Duke

Publications [#268267] of John E. Dolbow
Papers Published
 Gosz, MR; Dolbow, JE, Influence of outofplane insulator properties on the interfacial stresses in periodic electronic structures,
American Society of Mechanical Engineers (Paper)
(1995),
pp. 10pp
(last updated on 2018/10/14)
Abstract: While the inplane properties of thin polyimide films can be measured using standard thermalmechanical testing procedures, the experimental characterization of the outofplane properties (elastic constants and coefficient of thermal expansion) is very difficult due to the minute thickness of the film (on the order of one micron). In the present analysis, we treat the outofplane mechanical properties of the polyimide as design variables and investigate the effect of these properties on the thermal stresses that develop in a single layer copperpolyimide interconnection structure using a combined finite elementdesign of experiment method. The single layer interconnection structure is modeled by a threedimensional representative cell composed of square copper via in a thin polyimide film mounted on top of a silicon substrate. The cell is assumed to be stress free at an elevated temperature, and is subsequently cooled uniformly. In the analysis, we obtain the initial elastic response of the cell for each combination of the outofplane polyimide properties called for in the experimental design, and generate response functions for the stress components at key bimaterial interfaces. Additional finite element trials are then performed over a broad temperature range allowing for copper plasticity to investigate the role of the outofplane polyimide properties when a material nonlinearity is present in the structure.


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