Math @ Duke

Publications [#268319] of John E. Dolbow
Papers Published
 Dolbow, J; Gosz, M, Effect of outofplane properties of a polyimide film on the stress fields in microelectronic structures,
Mechanics of Materials, vol. 23 no. 4
(1996),
pp. 311321 [01676636(96)00021X], [doi]
(last updated on 2018/11/12)
Abstract: The detailed modeling of microelectronic structures involving thin polyimide films is difficult due to the limited amount of information available on the outofplane polyimide properties. In the present analysis, we treat the outofplane mechanical properties of the polyimide as design variables and investigate their effect on the thermal stresses that develop in a one layer copperpolyimide interconnection structure using a combined finite elementdesign of experiment method. The interconnection structure is modeled by a threedimensional representative cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate. The cell is assumed to be stress free at an elevated temperature, and it is subsequently cooled uniformly. In the analysis, we obtain the initial elastic response of the cell for each combination of the outofplane polyimide properties called for in the experimental design, and generate response functions for the stress components at key bimaterial interfaces. Additional finite element trials are then performed over a broad temperature range, allowing for copper plasticity, to investigate the role of the outofplane polyimide properties when a material nonlinearity is present in the structure.
Keywords: finite element analysis;plasticity;Poisson ratio;polymer films;stress analysis;stress relaxation;thermal stresses;Young's modulus;


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