Papers Published

1. Noia, B; Chakrabarty, K, Identification of defective TSVs in pre-bond testing of 3D ICs, Proceedings of the Asian Test Symposium (December, 2011), pp. 187-194, IEEE [doi] .
   (last updated on 2022/12/30)

   Abstract:
   Pre-bond testing of TSVs has been identified as a major challenge for yield assurance in 3D ICs. We present a defective-TSV localization technique based on pre-bond probing of a network of TSVs. We describe an efficient algorithm for designing parallel TSV test sessions such that test time is reduced and a given number of faulty TSVs within the TSV network can be uniquely identified. Optimization results for various networks of TSVs highlight significant reduction in test time using the proposed method. © 2011 IEEE.