Papers Published

1. Syed, US; Chakrabarty, K; Chandra, A; Kapur, R, 3D-scalable adaptive scan (3D-SAS), 2011 Ieee International 3d Systems Integration Conference, 3dic 2011 (December, 2011), IEEE [doi] .
   (last updated on 2022/12/30)

   Abstract:
   Performance requirements and interconnect bottlenecks associated with technology scaling have led to the development of 3D stacked ICs (3D-SICs) based on through-silicon vias (TSVs). Testing of 3D-SICs is challenging due to severely limited physical access. In a limited access situation, test compression offers a promising solution to the problem of testing 3D ICs. Scalable Adaptive Scan (SAS) requires a very narrow scan interface. This paper integrates SAS with known core test-wrapper designs and emerging die wrapper methods to provide an effective solution to the problem of testing 3D-SICs. © 2011 IEEE.