Papers Published

1. Noia, B; Chakrabarty, K; Marinissen, EJ, Optimization methods for post-bond testing of 3D stacked ICs, Journal of Electronic Testing: Theory and Applications (Jetta), vol. 28 no. 1 (January, 2012), pp. 103-120, Springer Nature [doi] .
   (last updated on 2022/12/30)

   Abstract:
   Testing of three-dimensional (3D) stacked ICs (SICs) is starting to receive considerable attention in the semiconductor industry. Since the die-stacking steps of thinning, alignment, and bonding can introduce defects, there may be a need to test multiple subsequent partial stacks during 3D assembly. We address the problem of test-architecture optimization for 3D stacked ICs to minimize overall test time when either the complete stack only, or the complete stack and multiple partial stacks, need to be tested. A general solution to this problem provides several options for 3D stack testing in a unified framework. We show that optimal test-architecture solutions and test schedules for multiple test insertions are different from their counterparts for a single final stack test. In addition, we present optimization techniques for the testing of TSVs and die-external logic in combination with the dies in the stack. © 2011 Springer Science+Business Media, LLC.