Papers Published

1. Mondal, S; Chakrabarty, K, Pre-Assembly testing of interconnects in embedded multi-die interconnect bridge (EMIB) dies, Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, Date 2018, vol. 2018-January (April, 2018), pp. 373-378 [doi] .
   (last updated on 2022/12/30)

   Abstract:
   The embedded multi-die interconnect bridge (EMIB) is an advanced packaging technology for 2.5D integration. This paper presents a bridge test architecture based on the proposed IEEE Std. P1838. The proposed test method enables access to interconnects at a pre-Assembly stage by pairing the interconnects using metal shorts and probing on coarse-pitch C4 bumps. It can efficiently detect resistive-open and resistive-short defects in the bridge interconnects and micro-bumps. Simulation results are presented to evaluate the range of defects that can be detected by the proposed method.