Books

1. Wang, R; Chakrabarty, K, Testing of interposer-based 2.5D integrated circuits (March, 2017), pp. 1-182, Springer International Publishing [doi] .
   (last updated on 2022/12/30)

   Abstract:
   This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.