Papers Published

1. Das, S; Basu, K; Doppa, JR; Pande, PP; Karri, R; Chakrabarty, K, Abetting Planned Obsolescence by Aging 3D Networks-on-Chip, 2018 12th Ieee/Acm International Symposium on Networks on Chip, Nocs 2018 (October, 2018), IEEE [doi] .
   (last updated on 2022/12/30)

   Abstract:
   We set up a security analysis framework by aging the Network-on-Chip (NoC) to study planned obsolescence by the original equipment manufacturer (OEM). An NoC is the communication backbone in a manycore System-on-Chip (SoC). Planned obsolescence may adopt any vulnerability in the NoC to cause the SoC to fail. We show how an OEM can craft workloads to generate electromigration-induced stress and crosstalk noise in TSV-based vertical links in the NoC to hasten failure. We analyzed three malicious workloads and confirm that a crafted workload that injects 3-10% more traffic on to a few selected critical vertical links can shorten the lifetime of the NoC by 11%-25% averaged over the benchmarks considered in this work.