Publications [#346256] of Benjamin J. Wiley

Journal Articles

1. Kim, MJ; Cruz, MA; Ye, S; Gray, AL; Smith, GL; Lazarus, N; Walker, CJ; Sigmarsson, HH; Wiley, BJ, One-step electrodeposition of copper on conductive 3D printed objects, Additive Manufacturing, vol. 27 (May, 2019), pp. 318-326 [doi]
   (last updated on 2026/01/14)

   Abstract:
   3D printing with electrically conductive filaments enables rapid prototyping and fabrication of electronics, but the performance of such devices can be limited by the fact that the most conductive thermoplastic-based filaments for 3D printing are 3750 times less conductive than copper. This study explores the use of one-step electrodeposition of copper onto electrically conductive 3D printed objects as a way to improve their conductivity and performance. Comparison of three different commercially-available conductive filaments demonstrates that only the most conductive commercially available filament could enable one-step electrodeposition of uniform copper films. Electrodeposition improved the electrical conductivity and the ampacity of 3D printed traces by 94 and 17 times respectively, compared to the as-printed object. The areal surface roughness of the objects was reduced from 9.3 to 6.9 μm after electrodeposition, and a further reduction in surface roughness to 3.9 μm could be achieved through the addition of organic additives to the electrodeposition bath. Copper electrodeposition improved the quality factor of a 3D printed inductor by 1740 times and the gain of a 3D printed horn antenna by 1 dB. One-step electrodeposition is a fast and simple way to improve the conductivity and performance of 3D printed electronic components.