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| Publications [#60697] of Martin A. Brooke
search ieeexplore.ieee.org.Papers Published
- Jokerst, Nan Marie and Brooke, Martin A. and Vendier, Olivier and Wilkinson, Scott and Fike, Suzanne and Lee, Myunghee and Twyford, Elizabeth and Cross, Jeffrey and Buchanan, Brent and Wills, Scott, Thin-film multimaterial optoelectronic integrated circuits,
IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, vol. 19 no. 1
(1996),
pp. 97 - 106 [96.486491]
(last updated on 2007/04/11)
Abstract: The multimaterial integration of thin-film optoelectronic devices with host substrates ranging from silicon circuits to glass waveguides to polymer micromachines offers to the system designer the freedom to choose the optimal materials for each component to achieve performance and cost objectives. Thin-film compound semiconductor optoelectronic devices are comparable to, and, in some cases, better than, their on-wafer counterparts. Thin-film detectors have been integrated with receiver circuits and movable micromachines, thin-film emitters with drive circuitry, and both have been used to demonstrate three-dimensionally interconnected systems. Vertical electrical integration of detector arrays on top of circuits is examined for massively parallel processing of images. Vertical optical interconnections of stacked silicon circuits (which are transparent to the wavelength of light used) are explored, and are used to develop a massively parallel processing architecture based upon low memory, high throughput, and high input/output.
Keywords: Thin film devices;Optoelectronic devices;Optical glass;Optical waveguides;Semiconducting polymers;Optical interconnects;Three dimensional;Detectors;Arrays;Three dimensional;Imaging systems;
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