Publications [#60767] of Martin A. Brooke

Papers Published

1. Brooke, Martin and Jokerst, Nan Marie and Bond, Steven W. and Wills, D. Scott, Comparison of CMOS chip to chip interconnections: Vertical optical through-Si links versus high density electrical interconnect, Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS, vol. 2 (1998), pp. 186 - 187, Orlando, FL, USA [LEOS.1998.739523]
   (last updated on 2007/04/11)

   Abstract:
   High density interconnect (HDI) electrical interconnections and vertical optoelectronic (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon the Semiconductor Industry Association (SIA) Roadmap projections, which indicate interconnection as a challenge area for coming generations of electronics, optoelectronics may serve a role in chip to chip interconnections for massively parallel computational systems.

   Keywords:
   CMOS integrated circuits;Microprocessor chips;Electric losses;Semiconductor device models;Optical links;