Publications [#67622] of Richard B. Fair

Papers Published

1. Fair, R.B., Rapid thermal annealing issues in silicon processing, Transient Thermal Processing Techniques in Electronic Materials. Proceedings of Symposium held during the 1996 TMS Annual Meeting (1996), pp. 61 - 6, Anaheim, CA, USA
   (last updated on 2007/04/17)

   Abstract:
   Rapid thermal processing technology has found its way onto the manufacturing floor of the semiconductor fab in certain selective processes that are not highly sensitive to the resulting temperature variations across the wafers. The use of optical radiation as a means of heating wafers has many inherent issues in temperature control and uniformity, especially if the wafer has multiple thin film layers and patterns. Since optical means of detecting wafer temperature depend on knowledge of wafer and system emissivity, the problem of temperature control remains critical. As a result, the introduction of thin film growth processes by RTCVD have been problematical due to the relatively high activation energies of the chemical processes involved. This paper also discusses the thermophysics issues of heating integrated circuit product wafers by RTP

   Keywords:
   chemical vapour deposition;elemental semiconductors;emissivity;heating;integrated circuit technology;process control;rapid thermal annealing;rapid thermal processing;silicon;temperature control;temperature measurement;