Publications [#66497] of Nan M. Jokerst

Papers Published

1. Jaemin Shin and Chung-Seok Seo and Chellappa, A. and Brooke, M. and Chatterjee, A. and Jokerst, N.M., Comparison of electrical and optical interconnect, 53rd Electronic Components and Technology Conference. Proceedings (Cat. No.03CH37438) (2003), pp. 1067 - 72, New Orleans, LA, USA [ECTC.2003.1216422]
   (last updated on 2007/04/16)

   Abstract:
   In this paper, we present a comparison between electrical and optical interconnect for chip-to-chip signaling in terms of data rate and system power consumption on FR4 circuit boards. The results show that optical interconnection is the only functional technology for a single serial line of 20 cm length at a 10 Gbps data rate. Low power CMOS logic driving parallel unterminated copper interconnect on FR4 substrates should be replaced by terminated transmission lines at 10 cm lengths for 10 Gbps aggregate throughput and at 20 cm for 1 Gbps aggregate throughput. Terminated copper transmission line interconnect on FR4 substrates can achieve 10 Gbps per line operation at 20 cm, provided no vias are used in the interconnect, or via technology with low reflection loss is developed. With vias, terminated copper transmission line interconnect must be replaced at 20 cm for 10 Gbps per line, however, 4 parallel terminated transmission lines with vias each running at 2.5 Gbps can achieve 10 Gbps aggregate communication over a 20 cm length. Thus, serial optics should only be used to replace 4 parallel electrical transmission lines if the power dissipation of the optical driver circuitry is less than 4 times the 2.5 Gbps electrical driver power consumption

   Keywords:
   CMOS digital integrated circuits;copper;data communication;high-frequency transmission lines;interconnections;optical interconnections;optical waveguides;transient analysis;