Publications [#67657] of Richard B. Fair

Papers Published

1. Fair, R.B. and Turlik, I., Proof-of-concept collaboration model for advanced packaging research at MCNC, Proceedings. International Conference and Exhibition. Multichip Modules (SPIE Proc. vol.1986) (1993), pp. 552 - 6, Denver, CO, USA
   (last updated on 2007/04/17)

   Abstract:
   MCNC's research in flip chip processing has occurred over several years within the Center and in concert with several universities. In order to make the research available to industry, a Flip Chip Technology Center (FCTC) has been established within MCNC to help industry evaluate the technology applied to their own ICs. The model for FCTC is the proof-of-concept model which allows for promising technologies to be actively transferred with the cooperation and shared costs of industry with leverage from the federal government

   Keywords:
   electronics industry;flip-chip devices;packaging;research initiatives;technology transfer;