Publications [#67735] of Richard B. Fair

Papers Published

1. Proceedings of the Sixth International Symposium on Ultralarge Scale Integration Science and Technology. ULSI Science and Technology 1997, edited by Massoud, H.Z.;Iwai, H.;Claeys, C.;Fair, R.B.; (1997), pp. xiii+664 -, Montreal, Que., Canada
   (last updated on 2007/04/17)

   Abstract:
   The following topics were dealt with: silicon wafer technology; ultracleaning technology; SOI and ultrathin dielectrics; ultrashallow junctions and contacts; contact hole formation; electromigration and packaging; interconnect and planarization; device and process modeling; process integration; lithography; DRAM and flash memory

   Keywords:
   integrated circuit technology;ULSI;