Publications [#67758] of Richard B. Fair

Papers Published

1. Vasudevan, N. and Massoud, H.Z. and Fair, R.B., Thermal model for the initiation of programming in metal-to-metal amorphous-silicon antifuses, Journal of the Electrochemical Society, vol. 146 no. 4 (1999), pp. 1536 - 1539 [1.1391800]
   (last updated on 2007/04/17)

   Abstract:
   A thermal model for the initiation of programming in metal-to-metal amorphous-silicon antifuses is described. The current and field crowding at the edges of the via cause the temperature at the via corners to increase due to Joule heating. Programming is initiated when the temperature at the via edges reaches the melting temperature of amorphous silicon. The model presented in this work explains how the thickness of the amorphous-silicon layer, the ambient temperature, and the duration of the programming pulse affect the programming process.

   Keywords:
   Mathematical models;Thermal effects;Electric currents;Electric potential;Thickness measurement;Electric resistance;Electrochemical electrodes;Plasma enhanced chemical vapor deposition;Aluminum;Silicon;Copper;